Mask-induced best-focus-shifts in DUV and EUV lithography
Andreas Erdmann, Peter Evanschitzky, Jens Timo Neumann, Paul Gräupner
Abstract
Andreas Erdmann, Peter Evanschitzky, Jens Timo Neumann, Paul Gräupner
Abstract
The mask plays a significant role as an active optical element in lithography, for both EUV and immersion lithography. Mask-induced and feature dependent shifts of the best focus position and other aberration-like effects were reported both for deep ultraviolet (DUV) immersion and for EUV lithography. We employ rigorous computation of light diffraction from lithographic masks in combination with aerial image simulation to study the root causes of these effects and their dependencies from mask and optical system parameters. Special emphasis is put on the comparison of transmission masks for DUV lithography and reflective masks for EUV lithography, respectively.
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The mask plays a significant role as an active optical element in lithography, for both EUV and immersion lithography. Mask-induced and feature dependent shifts of the best focus position and other aberration-like effects were reported both for deep ultraviolet (DUV) immersion and for EUV lithography. We employ rigorous computation of light diffraction from lithographic masks in combination with aerial image simulation to study the root causes of these effects and their dependencies from mask and optical system parameters. Special emphasis is put on the comparison of transmission masks for DUV lithography and reflective masks for EUV lithography, respectively.
Key concepts: Extreme ultraviolet lithography, Immersion lithography, Lithography, Optics, Materials science, Resist, X-ray lithography, Photolithography