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Fabrication of Submicrometer Features on Curved Substrates by Microcontact Printing

Rebecca J. Jackman, James L. Wilbur, George M. Whitesides

Open publisher page 435 citations

Abstract

Microcontact printing (mu CP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet-chemical etching that uses the patterned SAMs as resists transfers the patterns formed by mu CP into gold. At present, there is no comparable method for microfabrication on curved surfaces.

About this research paper

What this paper is about

Microcontact printing (mu CP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet-chemical etching that uses the patterned SAMs as resists transfers the patterns formed by mu CP into gold. At present, there is no comparable method for microfabrication on curved surfaces.

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OpenAlex reports 435 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Microcontact printing (mu CP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet-chemical etching that uses the patterned SAMs as resists transfers the patterns formed by mu CP into gold. At present, there is no comparable method for microfabrication on curved surfaces.

Key concepts: Microcontact printing, Fabrication, Nanotechnology, Materials science, Medicine, Alternative medicine, Pathology

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