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Preparation of Fe–Zn alloy deposits by electroless plating

H. Chen, J. Zhang, Yifang Ouyang, Xiankang Zhong

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Abstract

Fe–Zn binary alloys have been deposited by electroless plating. The films were prepared on a copper substrate in contact with an aluminium strip. The effects of the concentration of ligand, reducing agent, pH value, temperature of plating bath and plating time on the deposition rate, and structure and morphology of the films have been studied. A practical electroless plating solution has been developed.

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What this paper is about

Fe–Zn binary alloys have been deposited by electroless plating. The films were prepared on a copper substrate in contact with an aluminium strip. The effects of the concentration of ligand, reducing agent, pH value, temperature of plating bath and plating time on the deposition rate, and structure and morphology of the films have been studied. A practical electroless plating solution has been developed.

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OpenAlex reports 6 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Fe–Zn binary alloys have been deposited by electroless plating. The films were prepared on a copper substrate in contact with an aluminium strip. The effects of the concentration of ligand, reducing agent, pH value, temperature of plating bath and plating time on the deposition rate, and structure and morphology of the films have been studied. A practical electroless plating solution has been developed.

Key concepts: Plating (geology), Materials science, Electroless plating, Alloy, Copper plating, Aluminium, Gold plating (software engineering), Metallurgy

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