Influence of Reflow Soldering Process Parameters on the Lead-Free Reflow Profile

Reflow soldering process parameters have distinct effect on the lead-free reflow profile and its key indicators. To determine the relationship between reflow soldering process parameters and lead-free reflow profile is significant for obtaining the correct reflow profile. The result of orthogonal experimental shows that the most influential factors of the change rate of heat-up RS are conveyor speed S, temperature set value of the heating zone 1 T1 and the temperature set value of heating zone 2 T2 in sequence; the most influential factors of the soaking time TS are conveyor speed S, the temperature set value of heating zone 4 T4 and the temperature set value of heating zone 2 T2 in sequence; the most influential factors of the reflow peak temperature PT are conveyor speed S, the temperature set value of heating zone 7 T7 and the temperature set value of heating zone 6 T6 in sequence; the most influential factors of the reflow time TAL are conveyor speed S and the temperature set value of heating zone 6 T6 in sequence.