2013•IntermetallicsRequires access

Microstructure evolution and mechanical properties of transient liquid phase (TLP) bonded joints of TiAl intermetallics

Tiesong Lin, Haixin Li, Peng He, Hongmei Wei, Liang Li, Jicai Feng

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Key concepts: Materials science, Intermetallic, Isothermal process, Microstructure, Composite material, Layer (electronics), Dissolution, Phase (matter)

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Microstructure evolution and mechanical properties of transient liquid phase (TLP) bonded joints of TiAl intermetallics — Research Paper | ScholarLens