1985Electronics LettersRequires access

Threshold voltage adjustable process for self-aligned gate GaAs JFET

Shiban Tiku

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Abstract

A self-aligned GaAs JFET process, allowing threshold voltage adjustment after gate metallisation, has been developed. Zn-doped tungsten silicide was used as the gate metallisation, which also acts as the source of Zn diffusion for the p-junction gate. The threshold voltage was adjusted by repeated short thermal pulses in a lamp annealer at 550°C. The process has the potential to solve the most difficult task of threshold voltage control necessary for achieving high yield in LSI fabrication.

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What this paper is about

A self-aligned GaAs JFET process, allowing threshold voltage adjustment after gate metallisation, has been developed. Zn-doped tungsten silicide was used as the gate metallisation, which also acts as the source of Zn diffusion for the p-junction gate. The threshold voltage was adjusted by repeated short thermal pulses in a lamp annealer at 550°C. The process has the potential to solve the most difficult task of threshold voltage control necessary for achieving high yield in LSI fabrication.

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Available abstract

A self-aligned GaAs JFET process, allowing threshold voltage adjustment after gate metallisation, has been developed. Zn-doped tungsten silicide was used as the gate metallisation, which also acts as the source of Zn diffusion for the p-junction gate. The threshold voltage was adjusted by repeated short thermal pulses in a lamp annealer at 550°C. The process has the potential to solve the most difficult task of threshold voltage control necessary for achieving high yield in LSI fabrication.

Key concepts: JFET, Materials science, Threshold voltage, Optoelectronics, Fabrication, Voltage, Silicide, Tungsten

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