2013•Microelectronic EngineeringRequires access

Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

Jayalakshmi Parasuraman, Anand Summanwar, Frédéric Marty, Philippe Basset, Dan Angelescu, Tarik Bourouina

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Key concepts: Deep reactive-ion etching, Aspect ratio (aeronautics), Micrometer, Trench, Etching (microfabrication), Materials science, Figure of merit, Reactive-ion etching