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1991•Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and PhenomenaRequires access

The application of the helicon source to plasma processing

Andrew Perry, D. Vender, Rod Boswell

Open publisher page 245 citations

Abstract

The results of a study of the mode transitions in the helicon source when used in the geometry required for plasma processing are presented. We find that the basic characteristics of high density (>5×1011 cm−3 in the processing chamber at 500 W) and low plasma potential (∼15 V) are observed in this configuration. The mode transitions can be interpreted in terms of the dispersion relation for the helicon wave. A study of the initial plasma breakdown has also been made and the results have aided in the understanding of the operation of the helicon source during pulsed plasma etching.

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What this paper is about

The results of a study of the mode transitions in the helicon source when used in the geometry required for plasma processing are presented. We find that the basic characteristics of high density (>5×1011 cm−3 in the processing chamber at 500 W) and low plasma potential (∼15 V) are observed in this configuration. The mode transitions can be interpreted in terms of the dispersion relation for the helicon wave. A study of the initial plasma breakdown has also been made and the results have aided in the understanding of the operation of the helicon source during pulsed plasma etching.

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Available abstract

The results of a study of the mode transitions in the helicon source when used in the geometry required for plasma processing are presented. We find that the basic characteristics of high density (>5×1011 cm−3 in the processing chamber at 500 W) and low plasma potential (∼15 V) are observed in this configuration. The mode transitions can be interpreted in terms of the dispersion relation for the helicon wave. A study of the initial plasma breakdown has also been made and the results have aided in the understanding of the operation of the helicon source during pulsed plasma etching.

Key concepts: Helicon, Plasma, Plasma processing, Atomic physics, Etching (microfabrication), Plasma etching, Materials science, Physics

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