2013•Advanced materials researchOpen access

Phase-Field Micro-Solidification Simulation for Dendrite Growth in Ni-Cu Binary Alloy

Wei Zhou Hou, Hong Kui Mao

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Abstract

By optimizing the relevant dendrite growth parameters of Ni-Cu alloy undercooling melt, it has studied the effect that the dendrite evolution process of undercooled melt and the degree of undercooling melt have on the dendrite growth of undercooling melt. In the isothermal and non-isothermal solidification condition, relatively accurate result is obtained by applying the phase field method to simulate Ni-Cu alloy. Simulation results show non-isothermal simulation with Neuman boundary condition suit to the actual physical process better.

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What this paper is about

By optimizing the relevant dendrite growth parameters of Ni-Cu alloy undercooling melt, it has studied the effect that the dendrite evolution process of undercooled melt and the degree of undercooling melt have on the dendrite growth of undercooling melt. In the isothermal and non-isothermal solidification condition, relatively accurate result is obtained by applying the phase field method to simulate Ni-Cu alloy. Simulation results show non-isothermal simulation with Neuman boundary condition suit to the actual physical process better.

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Available abstract

By optimizing the relevant dendrite growth parameters of Ni-Cu alloy undercooling melt, it has studied the effect that the dendrite evolution process of undercooled melt and the degree of undercooling melt have on the dendrite growth of undercooling melt. In the isothermal and non-isothermal solidification condition, relatively accurate result is obtained by applying the phase field method to simulate Ni-Cu alloy. Simulation results show non-isothermal simulation with Neuman boundary condition suit to the actual physical process better.

Key concepts: Supercooling, Dendrite (mathematics), Isothermal process, Materials science, Alloy, Phase (matter), Thermodynamics, Metallurgy

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