Manual cleaving of anodically bonded silicon/glass wafers

Packaging technologies are a great issue in MEMS/NEMS fabrication. Moreover, silicon to glass anodic bonding is a common boding technique for MEMS/NEMS packaging. Hence, dicing the wafer into individual devices is a real challenge for fragile structures. This investigation shows an extension of the manual cleaving dicing for bonded silicon/glass wafers. The designed structure with no coincident anchors between silicon and glass avoids that the fracture expands toward the interior of the device during manual cleaving. Highest stresses are localized on the anchors, causing the fracture in those points. This method was experimentally tested to dice anodically bonded silicon-glass wafers.