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2010•IPSJ Transactions on System and LSI Design MethodologyOpen access

Advances and Challenges in 3D Physical Design

Jason Cong, Guojie Luo

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Abstract

The task of 3D physical design is to map a circuit from a netlist (structural) representation into a geometric (physical) representation according to a specific 3D IC technology with multiple active device layers. This paper discusses the recent progress made on the major steps in 3D physical design, including 3D floorplanning, 3D placement, 3D routing and thermal through-silicon via (TS via) planning, and outlines the challenges ahead.

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What this paper is about

The task of 3D physical design is to map a circuit from a netlist (structural) representation into a geometric (physical) representation according to a specific 3D IC technology with multiple active device layers. This paper discusses the recent progress made on the major steps in 3D physical design, including 3D floorplanning, 3D placement, 3D routing and thermal through-silicon via (TS via) planning, and outlines the challenges ahead.

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Available abstract

The task of 3D physical design is to map a circuit from a netlist (structural) representation into a geometric (physical) representation according to a specific 3D IC technology with multiple active device layers. This paper discusses the recent progress made on the major steps in 3D physical design, including 3D floorplanning, 3D placement, 3D routing and thermal through-silicon via (TS via) planning, and outlines the challenges ahead.

Key concepts: Netlist, Physical design, Computer science, Floorplan, Representation (politics), Routing (electronic design automation), Task (project management), Computer architecture

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