2011•Microelectronics JournalRequires access

Thermal analysis of high power LED package with heat pipe heat sink

Xiangyou Lu, Tse‐Chao Hua, Yanping Wang

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Key concepts: Heat sink, Thermal management of high-power LEDs, Heat pipe, Thermal resistance, Materials science, Junction temperature, Heat spreader, Thermal

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Thermal analysis of high power LED package with heat pipe heat sink — Research Paper | ScholarLens