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Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

Srivalli Chellvarajoo, M.Z. Abdullah, Zambri Samsudin

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Key concepts: Solder paste, Soldering, Nanoindentation, Materials science, Nanocomposite, Reflow soldering, Nanoparticle, Microstructure

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Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process — Research Paper | ScholarLens