SiC Particles Concentration Dependent the Properties of Electroless Ni-P-SiC Coatings
Yan Hai Cheng, Shi Ju Zhang, Yu Xing Peng, Fang Fang Xing, Jie Li, Zhen Cai Zhu
Abstract
Yan Hai Cheng, Shi Ju Zhang, Yu Xing Peng, Fang Fang Xing, Jie Li, Zhen Cai Zhu
Abstract
In this study, Ni-P-SiC composite coatings were prepared by adding different amount of SiC particles into electroless Ni-P plating solution. The effects of SiC particles concentration in solution on depositing rate and composition of the coatings were investigated. The different SiC contents in coatings could be obtained by adjusting the amount of SiC particle concentration in electroless plating solution. Scanning electron microscopy (SEM) results indicate that SiC particles are dispersed in the composite coating and Ni-P alloy is mainly as a bond metal envelope with SiC particles. At the same time, the microhardness became increased and the wear resistance improved with the increasing of SiC content.
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In this study, Ni-P-SiC composite coatings were prepared by adding different amount of SiC particles into electroless Ni-P plating solution. The effects of SiC particles concentration in solution on depositing rate and composition of the coatings were investigated. The different SiC contents in coatings could be obtained by adjusting the amount of SiC particle concentration in electroless plating solution. Scanning electron microscopy (SEM) results indicate that SiC particles are dispersed in the composite coating and Ni-P alloy is mainly as a bond metal envelope with SiC particles. At the same time, the microhardness became increased and the wear resistance improved with the increasing of SiC content.
Key concepts: Materials science, Scanning electron microscope, Composite number, Plating (geology), Indentation hardness, Electroless plating, Particle (ecology), Coating