2014•Unpublished venueRequires access

DSOI FET - A novel TID tolerant SOI transistor

Kai Zhao, X. Zhao, Jiantou Gao, Jinshun Bi, Jiajun Luo, Yu Fang, Zhongli Liu

Open publisher page 14 citations

Abstract

Charge trapping in the buried oxide can lead to serious back-channel leakage and make SOI (Silicon-on-Insulator) transistors more sensitive to total dose radiation. In this paper, a new DSOI (Double SOI) transistor is proposed, which utilizes the method of back-gate biasing to force an external electric field, and then depress the back channel formation during total dose irradiation. The simulation and testing results both indicate that, for a given structure, when a -3V bias is applied to the back-gate, the DSOI transistor can tolerant a total dose radiation of 500k rad(Si). This methodology fits all kinds of SOI MOSFETs, especially for the Fully-Depletion SOI transistors. With commercial (not especially hardened) buried oxide, DSOI device can have better radiation hardening performance than its both companions - FDSOI and PDSOI transistors.

About this research paper

What this paper is about

Charge trapping in the buried oxide can lead to serious back-channel leakage and make SOI (Silicon-on-Insulator) transistors more sensitive to total dose radiation. In this paper, a new DSOI (Double SOI) transistor is proposed, which utilizes the method of back-gate biasing to force an external electric field, and then depress the back channel formation during total dose irradiation. The simulation and testing results both indicate that, for a given structure, when a -3V bias is applied to the back-gate, the DSOI transistor can tolerant a total dose radiation of 500k rad(Si). This methodology fits all kinds of SOI MOSFETs, especially for the Fully-Depletion SOI transistors. With commercial (not especially hardened) buried oxide, DSOI device can have better radiation hardening performance than its both companions - FDSOI and PDSOI transistors.

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Available abstract

Charge trapping in the buried oxide can lead to serious back-channel leakage and make SOI (Silicon-on-Insulator) transistors more sensitive to total dose radiation. In this paper, a new DSOI (Double SOI) transistor is proposed, which utilizes the method of back-gate biasing to force an external electric field, and then depress the back channel formation during total dose irradiation. The simulation and testing results both indicate that, for a given structure, when a -3V bias is applied to the back-gate, the DSOI transistor can tolerant a total dose radiation of 500k rad(Si). This methodology fits all kinds of SOI MOSFETs, especially for the Fully-Depletion SOI transistors. With commercial (not especially hardened) buried oxide, DSOI device can have better radiation hardening performance than its both companions - FDSOI and PDSOI transistors.

Key concepts: Silicon on insulator, Transistor, Materials science, Optoelectronics, Leakage (economics), Threshold voltage, MOSFET, Radiation

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