2013Unpublished venueRequires access

A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics

Yu Zhang, Pengli Zhu, Rong Sun, Ching‐Ping Wong

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Abstract

Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30 min under inert atmosphere.

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What this paper is about

Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30 min under inert atmosphere.

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OpenAlex reports 5 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30 min under inert atmosphere.

Key concepts: Electrical conductor, Conductive ink, Copper, Materials science, Printed electronics, Inkwell, Nanoparticle, Electrical resistivity and conductivity

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