A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics
Yu Zhang, Pengli Zhu, Rong Sun, Ching‐Ping Wong
Abstract
Yu Zhang, Pengli Zhu, Rong Sun, Ching‐Ping Wong
Abstract
Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30 min under inert atmosphere.
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Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30 min under inert atmosphere.
Key concepts: Electrical conductor, Conductive ink, Copper, Materials science, Printed electronics, Inkwell, Nanoparticle, Electrical resistivity and conductivity