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2008•2008 Second International Conference on Integration and Commercialization of Micro and NanosystemsRequires access

Investigation on the Effects of Copper Electroplating Process

Yue Chen, Xiuhan Li, Shi Qing Chen, Haixia Zhang

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Abstract

This paper mainly discusses DC electroplating process parameter, especially the current density, affects the electroplating result (such as copper grain, surface smooth, resistivity). A positive relationship has been found between the current density and the electrodepositing speed, copper grain diameter, core cluster as well as square resistivity. Furthermore, testing structures are designed to monitor the process on line. And an observation of fluctuation along the transection has been found which is also increased with the current density.

About this research paper

What this paper is about

This paper mainly discusses DC electroplating process parameter, especially the current density, affects the electroplating result (such as copper grain, surface smooth, resistivity). A positive relationship has been found between the current density and the electrodepositing speed, copper grain diameter, core cluster as well as square resistivity. Furthermore, testing structures are designed to monitor the process on line. And an observation of fluctuation along the transection has been found which is also increased with the current density.

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Key contribution

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Method / approach

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Available abstract

This paper mainly discusses DC electroplating process parameter, especially the current density, affects the electroplating result (such as copper grain, surface smooth, resistivity). A positive relationship has been found between the current density and the electrodepositing speed, copper grain diameter, core cluster as well as square resistivity. Furthermore, testing structures are designed to monitor the process on line. And an observation of fluctuation along the transection has been found which is also increased with the current density.

Key concepts: Electroplating, Copper, Current density, Materials science, Electrical resistivity and conductivity, Copper plating, Metallurgy, Grain size

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