Improvement of mask-limited yield with a vote-taking lithographic scheme
Chong-Cheng Fu, David H. Dameron
Abstract
Chong-Cheng Fu, David H. Dameron
Abstract
A lithographic technique which can significantly reduce the effect of photomask defects is investigated. It is based on exposures of multiple reticle fields containing identical patterns, and is especially suitable for 1 × wafer steppers. The principle, requirements, and initial experimental results of this method are presented.
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A lithographic technique which can significantly reduce the effect of photomask defects is investigated. It is based on exposures of multiple reticle fields containing identical patterns, and is especially suitable for 1 × wafer steppers. The principle, requirements, and initial experimental results of this method are presented.
Key concepts: Reticle, Photomask, Lithography, Wafer, Yield (engineering), Photolithography, Electronic engineering, Computer science