Low Surface Concentration of Boron in Silicon by Diffusion Through Silicon Dioxide
W. von Muench, C. Gessert
Abstract
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W. von Muench, C. Gessert
Abstract
Open-access reader
It is shown that the diffusion of boron through a thin silicon dioxide layer can be used to control the surface acceptor concentration in silicon within the range from , with the junction depth varying from 0 to 15 μm. The diffusion constant of boron in was determined to be , for a boron surface concentration of about . Examples for the technical application of this method are briefly discussed.
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It is shown that the diffusion of boron through a thin silicon dioxide layer can be used to control the surface acceptor concentration in silicon within the range from , with the junction depth varying from 0 to 15 μm. The diffusion constant of boron in was determined to be , for a boron surface concentration of about . Examples for the technical application of this method are briefly discussed.
Key concepts: Boron, Silicon, Silicon dioxide, Diffusion, Acceptor, Materials science, Layer (electronics), Diffusion layer