2013Unpublished venueRequires access

Prediction of 3D-near field coupling between a toroïdal inductor and a transmission line

H. Shall, Zouheir Riah, M. Kadi

Open publisher page 10 citations

Abstract

This paper presents an application of a 3D near-field modeling approach to predict the coupling between a toroïdal inductor (TI) and a transmission line (TL) placed in its vicinity. The TI equivalent 3D emission model is combined with analytic coupling formulations to compute the induced voltages in different configurations of the victim line. The proposed modeling procedure is less consuming in terms of computing times, preserves DUT confidentiality and offers an accurate electromagnetic interference (EMI) prediction. Results enable designers to optimize components positions inside electronic boards to guarantee electromagnetic compatibility (EMC) of the whole system.

About this research paper

What this paper is about

This paper presents an application of a 3D near-field modeling approach to predict the coupling between a toroïdal inductor (TI) and a transmission line (TL) placed in its vicinity. The TI equivalent 3D emission model is combined with analytic coupling formulations to compute the induced voltages in different configurations of the victim line. The proposed modeling procedure is less consuming in terms of computing times, preserves DUT confidentiality and offers an accurate electromagnetic interference (EMI) prediction. Results enable designers to optimize components positions inside electronic boards to guarantee electromagnetic compatibility (EMC) of the whole system.

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OpenAlex reports 10 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

This paper presents an application of a 3D near-field modeling approach to predict the coupling between a toroïdal inductor (TI) and a transmission line (TL) placed in its vicinity. The TI equivalent 3D emission model is combined with analytic coupling formulations to compute the induced voltages in different configurations of the victim line. The proposed modeling procedure is less consuming in terms of computing times, preserves DUT confidentiality and offers an accurate electromagnetic interference (EMI) prediction. Results enable designers to optimize components positions inside electronic boards to guarantee electromagnetic compatibility (EMC) of the whole system.

Key concepts: Electromagnetic interference, Electromagnetic compatibility, EMI, Inductor, Transmission line, Coupling (piping), Electromagnetic field, Voltage

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