2006•Journal of Electronic MaterialsRequires access

Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates

S. S. Wang, Yao‐Huan Tseng, Tung‐Han Chuang

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Key concepts: Intermetallic, Electron microprobe, Soldering, Activation energy, Arrhenius plot, Electron probe microanalysis, Materials science, Diffusion

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Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates — Research Paper | ScholarLens