Critical Soldering Interconnect Technology in SMT
Xiao Hu
Abstract
Xiao Hu
Abstract
this paper introduced the important soldering interconnect technology in SMT. In electric product manufacturing process, sometime we must place components in through-hole ways , then we use wave soldering. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. As technology changing very soon, the through-hole components have been largely replaced by surface mount components, this time ,Reflow soldering is the most common method of attaching surface mount components to a circuit board,but not wave soldering also reflowing, we must focus on wetting , It quantifies the wettability of a solid surface by a liquid .wetting angle is a the important quantity (also called contact angle).it can judge the quality of solder joints.
A significance statement is not available in the OpenAlex record.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
this paper introduced the important soldering interconnect technology in SMT. In electric product manufacturing process, sometime we must place components in through-hole ways , then we use wave soldering. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. As technology changing very soon, the through-hole components have been largely replaced by surface mount components, this time ,Reflow soldering is the most common method of attaching surface mount components to a circuit board,but not wave soldering also reflowing, we must focus on wetting , It quantifies the wettability of a solid surface by a liquid .wetting angle is a the important quantity (also called contact angle).it can judge the quality of solder joints.
Key concepts: Soldering, Wave soldering, Dip soldering, Printed circuit board, Surface-mount technology, Wetting, Interconnection, Reflow soldering