2010•Microelectronics ReliabilityRequires access
Overview of wire bonding using copper wire or insulated wire
Z.W. Zhong
Open publisher page 109 citations
Abstract
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Z.W. Zhong
Abstract
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OpenAlex reports 109 citations for this work. Citation counts describe recorded attention and do not establish research quality.
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Key concepts: Wire bonding, Copper wire, Copper, Microelectronics, Wire drawing, Materials science, Wedge (geometry), Mechanical engineering