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1999•Microelectronics ReliabilityRequires access

Single chip bumping and reliability for flip chip processes

Matthias Klein, Hermann Oppermann, R. Kalicki, R. Aschenbrenner, H. Reichl

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Key concepts: Bumping, Flip chip, Soldering, Materials science, Wedge (geometry), Intermetallic, Reliability (semiconductor), Metallurgy

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