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2014•Unpublished venueRequires access

A novel method for IR-drop reduction in high-performance printed circuit boards

Yuehui Huang, Mu-Shui Zhang, Hong‐Zhou Tan

Open publisher page 8 citations

Abstract

In this paper, we studied the problem of IR drop of high performance multilayer printed circuit boards (PCBs). Adaptive mesh is used to simplify the process and improve efficiency. It is found that both vias contact of voltage regulator module (VRM) and the copper planes produce significant IR drop. A novel method for IR drop reduction is proposed, which can significantly reduce the resistance introduced by vias contact of VRM and copper planes. This method can reduce IR drop by about 50%. Furthermore, we also discuss the IR drop reduction for multi-plane structures. With reasonable design rules, the IR drop of PCBs with current demand of 100+A can be kept within a few tens of millivolt.

About this research paper

What this paper is about

In this paper, we studied the problem of IR drop of high performance multilayer printed circuit boards (PCBs). Adaptive mesh is used to simplify the process and improve efficiency. It is found that both vias contact of voltage regulator module (VRM) and the copper planes produce significant IR drop. A novel method for IR drop reduction is proposed, which can significantly reduce the resistance introduced by vias contact of VRM and copper planes. This method can reduce IR drop by about 50%. Furthermore, we also discuss the IR drop reduction for multi-plane structures. With reasonable design rules, the IR drop of PCBs with current demand of 100+A can be kept within a few tens of millivolt.

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OpenAlex reports 8 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

In this paper, we studied the problem of IR drop of high performance multilayer printed circuit boards (PCBs). Adaptive mesh is used to simplify the process and improve efficiency. It is found that both vias contact of voltage regulator module (VRM) and the copper planes produce significant IR drop. A novel method for IR drop reduction is proposed, which can significantly reduce the resistance introduced by vias contact of VRM and copper planes. This method can reduce IR drop by about 50%. Furthermore, we also discuss the IR drop reduction for multi-plane structures. With reasonable design rules, the IR drop of PCBs with current demand of 100+A can be kept within a few tens of millivolt.

Key concepts: Drop (telecommunication), Voltage drop, Power network design, Printed circuit board, Copper, Materials science, Drop out, Optoelectronics

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