2014•Advanced materials researchOpen access

Curing Process of Epoxy Resin Using Low Molecular Polyamide 651 as Curing Agent

Chun Hua Han, Lin Wang, Dong Yu Zhao

Abstract

In this paper low molecular polyamide 651(PA651) is used as the curing agent of epoxy resin. The optimum curing conditions and dosage of the curing agent are obtained by DMA and FT-IR analysis. Based on the dynamic mechanical temperature spectra of samples test, the best curing conditions are room temperature 2 hours, 70°C 2 hours, 125°C 2.5 hours and 150°C 1 hours (RT / 2 h + 70 °C / 2 h +125°C / 2.5 h + 150 °C / 1 h). The best dosage of curing agent PA651 is 50 wt %. Since the analysis of Fourier Infrared spectral verified that epoxy groups react completely, the curing conditions are the best curing process.

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Key concepts: Curing (chemistry), Epoxy, Polyamide, Materials science, Fourier transform infrared spectroscopy, Composite material, Chemical engineering, Engineering