A Material Selection Criterion for Hot-Stamping Dies
Yong Sheng Ye, Zhong Shan, Bao Yu Wang, Chao Jiang, Bai Liang Zhuang
Abstract
Yong Sheng Ye, Zhong Shan, Bao Yu Wang, Chao Jiang, Bai Liang Zhuang
Abstract
Hot-stamping technology applies hot-stamping dies to the forming and quenching of austenitized high-strength steel plates to produce super-high-strength parts. To carry out these forming and quenching functions, the hot-stamping dies must be able to withstand shock and high-temperature friction under harsh working conditions, and hence high-quality die materials are necessary. However, since the material performance requirements of hot-stamping dies have not been standardized, and special die materials have not been developed, the choice of materials is based on improving the safety coefficient, which leads to material waste and increased costs. In this article, the performance of the hot-stamping process is analyzed to obtain the main resistance indices and a material selection formula for hot-stamping dies, enabling the selection of hot-stamping die materials to be quantified, and thereby establishing a scientific basis for the selection process.
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Hot-stamping technology applies hot-stamping dies to the forming and quenching of austenitized high-strength steel plates to produce super-high-strength parts. To carry out these forming and quenching functions, the hot-stamping dies must be able to withstand shock and high-temperature friction under harsh working conditions, and hence high-quality die materials are necessary. However, since the material performance requirements of hot-stamping dies have not been standardized, and special die materials have not been developed, the choice of materials is based on improving the safety coefficient, which leads to material waste and increased costs. In this article, the performance of the hot-stamping process is analyzed to obtain the main resistance indices and a material selection formula for hot-stamping dies, enabling the selection of hot-stamping die materials to be quantified, and thereby establishing a scientific basis for the selection process.
Key concepts: Hot stamping, Stamping, Die (integrated circuit), Material selection, Quenching (fluorescence), Materials science, High strength steel, Shock (circulatory)