Modular Interconnect Packaging for Scalable Systems (MIPSS) for ATE - IEEE-P1693 standard

The IEEE-P1693, Modular Integration Packaging Scaleable System (MIPSS) standard as illustrated in Figure 1, defines the electrical and mechanical specifications of a modular interconnect packaging system design for Automatic Test System (ATS). It specifically describes a building block approach based upon the integration of three elements: (1) the outer enclosure and the inner Eurocard standard mechanical chassis that forms the mechanical structure of the building block with alignment features to mate with other enclosures [building blocks]; (2) a hopeful revision of the VME eXtensions for Instrumentation (VXI) chassis and component designs, that includes consideration of an IEEE-1155 backplane modification by the VXI Consortium Technical Committee [1], to add VME VXS 41.4 PCI Express serial bus control, with protocol enhancement under 2eSST, while the IEEE-P1693 working group continues to specify a new pluggable virtual power source, and mechanical extension that couples the VXI module directly to a transition panel that connects to an UUT or test interface choice emulating DOD Interface Standards [2]; and (3) the integration of the instrument modules and UUT personalty modules into a pluggable subassembly that interfaces with the basic enclosure building block.All of which is directly applicable to current DOD ATS (Fig.1).