Lithography solution for 65-nm node system LSIs
Takahiro Matsuo, Masayuki Endo, Shinji Kishimura, Akio Misaka, Masaru Sasago
Abstract
Takahiro Matsuo, Masayuki Endo, Shinji Kishimura, Akio Misaka, Masaru Sasago
Abstract
For 65-nm node devices, we have systematically investigated the lithographic margin of electron-beam projection lithography (EPL), ArF lithography and vacuum ultraviolet (VUV) lithography. Among them, EPL has sufficient margin and excellent pattern fidelity and our experiments have demonstrated that it can fabricate 65-nm node device patterns. Therefore, EPL is a strong candidate for 65-nm node lithography.
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For 65-nm node devices, we have systematically investigated the lithographic margin of electron-beam projection lithography (EPL), ArF lithography and vacuum ultraviolet (VUV) lithography. Among them, EPL has sufficient margin and excellent pattern fidelity and our experiments have demonstrated that it can fabricate 65-nm node device patterns. Therefore, EPL is a strong candidate for 65-nm node lithography.
Key concepts: Lithography, Next-generation lithography, Extreme ultraviolet lithography, Immersion lithography, Electron-beam lithography, X-ray lithography, Materials science, Computational lithography