ScholarLens Back to search
2002•Unpublished venueRequires access

High performance underfills development - materials, processes, and reliability

Luu T. Nguyen, Long Nguyen Hoang, PG Fine, Sheng Jun Shi, Michael Vincent, Larry Wang, Ching Ping Wong, Q.K. Tong, B. Ma, Robin R. Humphreys, Ann C. Savoca

Open publisher page 47 citations

Abstract

The typical underfill enhances the solder life of flip chip structures by up to an order of magnitude. With increasing packaging applications requiring flip chip interconnection, much industry interest has been devoted to the development of better underfill materials, which are more cost-effective and provide better performance than current commercial materials. This paper presents the highlights of a recent DARPA-funded program to develop new underfill materials for low-cost flip chip applications.

About this research paper

What this paper is about

The typical underfill enhances the solder life of flip chip structures by up to an order of magnitude. With increasing packaging applications requiring flip chip interconnection, much industry interest has been devoted to the development of better underfill materials, which are more cost-effective and provide better performance than current commercial materials. This paper presents the highlights of a recent DARPA-funded program to develop new underfill materials for low-cost flip chip applications.

Why it matters

OpenAlex reports 47 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

The typical underfill enhances the solder life of flip chip structures by up to an order of magnitude. With increasing packaging applications requiring flip chip interconnection, much industry interest has been devoted to the development of better underfill materials, which are more cost-effective and provide better performance than current commercial materials. This paper presents the highlights of a recent DARPA-funded program to develop new underfill materials for low-cost flip chip applications.

Key concepts: Flip chip, Interconnection, Reliability (semiconductor), Soldering, Materials science, Reliability engineering, Chip, Integrated circuit packaging

Related papers

Related paper 1Related paper 2Related paper 3
Back to paper searchBrowse research topicsOriginal source
High performance underfills development - materials, processes, and reliability — Research Paper | ScholarLens