2003Unpublished venueRequires access

Integration of R&M into CAE for product excellence

Walter Henry

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Abstract

Issues surrounding the integration of R&M (reliability and maintainability) analysis into CAE (computer-aided engineering) systems are addressed. The needs of companies like Boeing to accelerate the development of design decision support systems to produce products with good R&M characteristics are analysed. The author gives the Boeing status of the integration of R&M CAE, what Boeing has to accomplish, and the major technical barriers that Boeing is facing. Results of technology breakthroughs are described; they involve the development of methods for improving analysis of failure modes and effects, testability fault coverage and thermal stress for complex electronic systems.>

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What this paper is about

Issues surrounding the integration of R&M (reliability and maintainability) analysis into CAE (computer-aided engineering) systems are addressed. The needs of companies like Boeing to accelerate the development of design decision support systems to produce products with good R&M characteristics are analysed. The author gives the Boeing status of the integration of R&M CAE, what Boeing has to accomplish, and the major technical barriers that Boeing is facing. Results of technology breakthroughs are described; they involve the development of methods for improving analysis of failure modes and effects, testability fault coverage and thermal stress for complex electronic systems.>

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Available abstract

Issues surrounding the integration of R&M (reliability and maintainability) analysis into CAE (computer-aided engineering) systems are addressed. The needs of companies like Boeing to accelerate the development of design decision support systems to produce products with good R&M characteristics are analysed. The author gives the Boeing status of the integration of R&M CAE, what Boeing has to accomplish, and the major technical barriers that Boeing is facing. Results of technology breakthroughs are described; they involve the development of methods for improving analysis of failure modes and effects, testability fault coverage and thermal stress for complex electronic systems.>

Key concepts: Maintainability, Testability, Excellence, Reliability (semiconductor), Product (mathematics), Engineering, Fault tree analysis, System integration

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