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Practical Design Issues to Bump and Flip

Jack Bogdanski, Jim Leal, Hong Yang

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Abstract

As wafer bumping and flip chip attach techniques gain momentum in the chip packaging industry, awareness of the latest enabling design requirements and advantages will help the design and packaging engineer optimize the system cost, performance and reliability. Attention to the die level and wafer level parameters and details that make economical, scaleable, and manufacturable bump and flip IC's are the. topic of this paper.

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What this paper is about

As wafer bumping and flip chip attach techniques gain momentum in the chip packaging industry, awareness of the latest enabling design requirements and advantages will help the design and packaging engineer optimize the system cost, performance and reliability. Attention to the die level and wafer level parameters and details that make economical, scaleable, and manufacturable bump and flip IC's are the. topic of this paper.

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Available abstract

As wafer bumping and flip chip attach techniques gain momentum in the chip packaging industry, awareness of the latest enabling design requirements and advantages will help the design and packaging engineer optimize the system cost, performance and reliability. Attention to the die level and wafer level parameters and details that make economical, scaleable, and manufacturable bump and flip IC's are the. topic of this paper.

Key concepts: Bumping, Flip chip, Thermal copper pillar bump, Reliability (semiconductor), Chip-scale package, Engineering, Reliability engineering, Manufacturing engineering

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