Comparison of GaAs JFETs to MESFETs for high-temperature operation

GaAs-based Metal Semiconductor Field Effect transistors (MESFETs) and High Electron Mobility Transistors (HEMTs) have been the focus of research for high-temperature operation due to the 1.42 eV band gap of GaAs that reduces thermal carrier generation as compared to 1.1 eV silicon-based electronics. Although schemes have been proposed to minimize substrate currents at elevated temperatures, high-temperature operation of these devices is ultimately limited by the gate leakage current of the Schottky gate contact. Since a Junction Field Effect Transistor (JFET) has a higher gate barrier to current flow than a Schottky barrier MESFET as a result of the p/n junction gate, JFETs should have superior performance at elevated temperatures. This paper compares the high-temperature performance of a self-aligned GaAs MESFET and JFET. Both devices suffer from substrate leakage at high temperature; however, the JFET has superior gate characteristics and maintains a larger fraction of its room temperature transconductance at 300 C.