2006•Unpublished venueRequires access

Coupling Model for the Two Orthogonal Microstrip Lines in Two Layer PCB Board (Quasi-TEM Approach)

A. Cheldavi, M.H. Nasab

Abstract

In the present paper a simple model has been given to simulate the signal propagation through two cross-orthogonal microstrip lines in two different layers of the PCB board. First, the structure has been analyzed using full wave software like HFSS, then a suitable lumped equivalent circuit is proposed for the cross talk region and its parameters are obtained. Finally, results of this equivalent circuit compared with results of full wave simulations that obtained from HFSS and microwave office software.

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Available abstract

Key concepts: HFSS, Microstrip, Printed circuit board, Microwave, Equivalent circuit, Software, Electronic engineering, Coupling (piping)