2014•Electronics and Communications in JapanRequires access

On‐Chip Manipulation of Magnetic Beads for Integrated Immunosensor

Tomohiro Ishikawa, Jaesung Lee, Ryo Miyake

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Abstract

SUMMARY The purpose of this work is in‐plane manipulation of dispersed magnetic beads on a chip. This makes an immunoassay chip that completes all its procedures on itself and eliminates any off‐chip components. A test chip was drawn in a 180 nm standard complementary metal oxide semiconductor process and tested. Beads with a diameter of 2.8 μm were diluted and applied to the chip. The chip successfully manipulated them with an affordable current down to 5 mA.

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What this paper is about

SUMMARY The purpose of this work is in‐plane manipulation of dispersed magnetic beads on a chip. This makes an immunoassay chip that completes all its procedures on itself and eliminates any off‐chip components. A test chip was drawn in a 180 nm standard complementary metal oxide semiconductor process and tested. Beads with a diameter of 2.8 μm were diluted and applied to the chip. The chip successfully manipulated them with an affordable current down to 5 mA.

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Available abstract

SUMMARY The purpose of this work is in‐plane manipulation of dispersed magnetic beads on a chip. This makes an immunoassay chip that completes all its procedures on itself and eliminates any off‐chip components. A test chip was drawn in a 180 nm standard complementary metal oxide semiconductor process and tested. Beads with a diameter of 2.8 μm were diluted and applied to the chip. The chip successfully manipulated them with an affordable current down to 5 mA.

Key concepts: Chip, Materials science, Lab-on-a-chip, Nanotechnology, Optoelectronics, Engineering, Electrical engineering, Microfluidics

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