Post-Etch Cleaning after Dry Etching the Emitter Windows to Improve the Bipolar Characteristics in a 0.5μm BiCMOS Process
Stefaan Decoutere, S. Vanhaelemeersch, L. Deferm, F. Vleugels, G. Vancuyck
Abstract
Stefaan Decoutere, S. Vanhaelemeersch, L. Deferm, F. Vleugels, G. Vancuyck
Abstract
The opening of 0.5μm wide emitter windows in the base oxide to fabricate quasiselfaligned poly emitter bipolar transistors involves a dry oxide etching. This paper shows how appropriate post-etch cleaning substantially improves the base current characteristics and the emitter resistance of poly emitter bipolar transistors of a 0.5μm BiCMOS process.
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The opening of 0.5μm wide emitter windows in the base oxide to fabricate quasiselfaligned poly emitter bipolar transistors involves a dry oxide etching. This paper shows how appropriate post-etch cleaning substantially improves the base current characteristics and the emitter resistance of poly emitter bipolar transistors of a 0.5μm BiCMOS process.
Key concepts: Common emitter, Bipolar junction transistor, Etching (microfabrication), BiCMOS, Materials science, Optoelectronics, Dry etching, Oxide