Integral glass encapsulation for solar arrays. Quarterly progress report No. 11

This is the eleventh quarterly report under JPL/DOE program for the development of electrostatic bonding as a method of integrally encapsulating silicon solar cells in glass. Efforts for the current phase of this program are to continue to demonstrate process uniformity of encapsulation by electrostatic bonding. An additional goal for this program is to develop preformed contacts as a method of integrating cell processing into the encapsulation procedure, resulting in a low-cost module assembly technique. This report covers work performed during the period from 11 July - 10 October 1979.