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1995•The Journal of Japan Institute for Interconnecting and Packaging Electronic CircuitsOpen access

Micro-Interconnection Technology. Fluxless Flip Chip Solder Joining for High Density Interconnect.

G.J. Dishon, Stephen M. Bobbio, M.A. PENNINGTON, Robert F. Lipscomb, N. Koopman, S. Nangalia

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Abstract

[in Japanese]

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[in Japanese]

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Available abstract

[in Japanese]

Key concepts: Flip chip, Interconnection, Materials science, Soldering, Chip, Thermal copper pillar bump, Optoelectronics, Electronic engineering

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